摘要 |
PURPOSE:To enable mounting electronic components in high density by covering a connection unit of leads to a wiring board with an insulator. CONSTITUTION:Connection unit of leads 4 for externally connecting of a board 1 for placing electrically connected electronic components to a wiring board 3 for externally connecting is covered with an insulator 2. Accordingly, the connecting structure of the unit of the leads 4 to the board 3 is increased so as to be scarcely disconnected even if the impact is applied to the leads, the wiring board at the time of placing of the components or conveying, etc., and insulation is obtained between the adjacent leads 4. Thus, a migration, etc., scarcely occurs. In this manner, the components can be mounted in high density. |