发明名称 BOARD FOR MOUNTING ELECTRONIC COMPONENT
摘要 PURPOSE:To enable mounting electronic components in high density by covering a connection unit of leads to a wiring board with an insulator. CONSTITUTION:Connection unit of leads 4 for externally connecting of a board 1 for placing electrically connected electronic components to a wiring board 3 for externally connecting is covered with an insulator 2. Accordingly, the connecting structure of the unit of the leads 4 to the board 3 is increased so as to be scarcely disconnected even if the impact is applied to the leads, the wiring board at the time of placing of the components or conveying, etc., and insulation is obtained between the adjacent leads 4. Thus, a migration, etc., scarcely occurs. In this manner, the components can be mounted in high density.
申请公布号 JPH02135764(A) 申请公布日期 1990.05.24
申请号 JP19880289723 申请日期 1988.11.16
申请人 IBIDEN CO LTD 发明人 ENOMOTO NAOYASU;HIROI ATSUSHI
分类号 H01L23/50;H05K3/28;H05K3/40 主分类号 H01L23/50
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