VERFAHREN ZUM HERSTELLEN EINER HALBLEITERBAUEINHEIT UND VORRICHTUNG ZUR DURCHFUEHRUNG DES VERFAHRENS

摘要

In the case of known semiconductor units of compact construction embodying semiconductor elements having electrically insulating and thermally conducting mounting, the arrangement of a plurality of current conduction elements and also the alignment of all the components requires a disadvantageous process complexity for an efficient large scale manufacture. The process and device according to the invention simplifies the assembly of semiconductor elements and their current conduction elements. According to the process, the device is applied to a carrier plate (15) with the first contact elements as a conductor substructure which has sections formed as first and as second contact elements (1, 2) or as connecting elements. A semiconductor element is inserted in each case between first and second contact element. After joining by soldering, the transport strap (7) between the connecting elements (4, 5) is removed.