| 摘要 |
PURPOSE:To execute a high-accuracy bonding operation by a method wherein two points on a solid device or an outer lead are detected, a theta displacement amount is computed, a suction head is turned around a suction part as the center, the displacement amount is corrected, one part of the solid device or the outer lead is detected, a displacement amount in an X-Y direction is computed and a relative displacement in the X-Y direction with reference to a lead frame is corrected. CONSTITUTION:A solid device 3 is stamped from a film carrier by using a tool of a punching unit; it is sucked to a suction part 1a of a suction head 1. Then, an elevator arm 15 is shifted in an X-Y direction; a first detection part 40 for the solid device 3 is situated under a camera; a position of a first point 3a of the solid device 3 is detected. Then, the elevator arm 15 is driven in the X-Y direction by a predetermined prescribed amount; a second detection part 41 for the solid device 3 is situated under the camera; a position of a second point 3b of the solid device 3 is detected. A displacement amount of the solid device 3 is computed by using an arithmetic and logic unit on the basis of the two detection points 3a, 3b; a motor 17 is driven so as to correct the theta displacement amount of the solid device 3 on the basis of this computed result. |
