| 摘要 |
PURPOSE:To improve high density uniformity of an outer peripheral layer and surface layer, and make the material loss to be reduced by pressing it in letting a heat insulating material heated to the temperature or high of a tablet to be disposed in the molding space within dies. CONSTITUTION:A tablet 1 of an inorganic compound material is heated, and plate-shaped heat insulating materials 5a and granulated heat insulating materials 5b are heated to the temperature or high of the tablet 1. The heated tablet 1 is inserted into dies 2 heated to the temperature of 300 - 500 deg.C wherein the heat insulating materials 5a heated to the temperature or high of the plate- shaped tablet are disposed on the upper and lower parts (surface layer) therein, and the heated insulating materials 56 heated to the temperature or high of the granulated tablet are also disposed in the circumference (outer peripheral layer) thereof. In the next place, it is pressed by an upper punch 3, and lower punch 4 heated similar to the dies 2, thereby obtaining a molding. |
