发明名称 RESIN MOLDER
摘要 PURPOSE:To facilitate an efficient operation for replacing dies and, further, obtain high sealing reliability corresponding to the types of packages by a method wherein a specific chasing unit, specific main runner unit and specific setting plate are provided and the main runner unit and chasing unit can be replaced as one piece by replacing the setting plate. CONSTITUTION:A plurality of cavities are formed in parting planes of a pair of upper and lower dies of a resin molder and resin is cast in the cavities with a high pressure to form packages corresponding to the shapes of the cavities. A chasing unit 18 having runners and cavities on its main surface and having an ejector mechanism inside, a main runner unit 15 to which the chasing unit 18 is fitted so as to be attached and detached easily and which has a main runner 17 on its main surface and a setting plate 14 which is attached to the base unit 13 of the molder main part with the main runner unit 15 attached to it are provided in the molder. The main runner unit 15 and the chasing unit 18 can be replaced as one piece by replacing the setting plate 14.
申请公布号 JPH02134834(A) 申请公布日期 1990.05.23
申请号 JP19880287727 申请日期 1988.11.16
申请人 HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD 发明人 SHIMIZU TAKESHI;KUMANO JUNICHI
分类号 B29C45/02;B29C45/26;B29L31/34;H01L21/56 主分类号 B29C45/02
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