| 摘要 |
PURPOSE:To make the height of a part where a circuit element is mounted low and obtain a compact, low-profile device by mounting the circuit element at a board cutting part of a printed board. CONSTITUTION:The processing of a board cutting is performed so that an IC 3 for surface mounting is mounted upside down. Further, electrodes 2 for soldering component parts are provided at the surfaces of the board adjacent to a cutting part. Then lead wires 5 for transmitting electric signals to the electrodes 2 and the inside of the IC are extracted from the IC. As mentioned above, the processing of cutting is performed so that the IC 3 for surface mounting is mounted upside down. In such a processing, a part of each lead wire 5 comes into contact with each electrode 2 on the surface of the printed board 1 and its contact makes soldering between each lead wire 5 and electrode 2 stable. Each lead wire 5 and electrode 2 are installed at a cutting processing part after fitting their positions so that the IC for surface mounting is mounted upside down. |
