| 摘要 |
PURPOSE: To conduct a dynamic test completely before a circuit is mounted, reduce the necessary space, and make it possible to manufacture and mount without using any special tool or machine by making a substrate edge have a width of only several mm and providing a connection for testing a semiconductor chip outside the substrate edge. CONSTITUTION: A base plate 6 including a substrate 17 having a substrate area F1 a little larger than the semiconductor chip 8 is provided with a conductor path 4 which connects to a 1st connection 19 on one side and also connects to a test connection 5 positioned outside the area F1 on the other side. While the area 19 has a grid interval (d) nearly corresponding to the grid interval of a chip connection 22, the connection 5 is designed to a grid interval (c) and in this state, a test can be conducted by an ordinary test device. Then the chip 8 is fixed in a mount area 2 on the plate 6 and a connection 22 is connected to the area 19 by a conductor. Then the substrate 17 projects along all the sides, the substrate edge 23 having edge width B of only several mm extends beyond the semiconductor chip 8, and the connection for testing the circuit is not present at the edge 23. |
