发明名称 STAMPER AND DIE FOR MOLDING SYNTHETIC RESIN SUBSTRATE
摘要 PURPOSE:To prevent the movement of a stamper positively thereby to improve the service life of the stamper and the quality of a substrate by providing a part to be engaged with an engaging part at the side of a die in a direction along the surface of a cavity forming part. CONSTITUTION:When a stamper 20 is mounted in a movable core 14 of a die 10 thereby to form a substrate, a to-be-engaged part 30 of the stamper 20 is engaged with an engaging part 31 of the die 10. Therefore, the stamper 20 is prevented from being rotated over the surface of the movable core 14. Accordingly, it becomes unnecessary to strongly press the stamper so as to prevent the movement thereof, whereby the stamper 20 can be prevented from being deformed by the pressing force, thermal expansion or shrinkage. The stamper 20 can be positively engaged with the die 10 by the relative engagement between the to-be-engaged part 30 of the former and the engaging part 31 of the latter. Even when a resin is moved by a high injection pressure, the stamper 20 is not moved at all. Accordingly, the surface of the movable core 14 is never defective, and resin pressure allows neither transfer of defect to the stamper 20 nor deformation of the stamper.
申请公布号 JPH02134218(A) 申请公布日期 1990.05.23
申请号 JP19880289349 申请日期 1988.11.15
申请人 SEKISUI CHEM CO LTD 发明人 FUJINAWA HIROYA
分类号 B29C33/00;B29C33/16;B29C45/26;B29C45/37;B29L17/00;G11B7/26 主分类号 B29C33/00
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