| 摘要 |
PURPOSE:To produce the above head which has flatness of high accuracy by arraying and forming many thin-film magnetic head elements on a sheet of water, then cutting the wafer and subjecting the surface layers of the cut faces of the head assemblies to hot annealing. CONSTITUTION:The thin-film magnetic head elements are arranged and formed on the wafer 1 and thereafter, the wafer 1 is cut in the cutting positions (X1-X1) to (Xn+1-Xn+1) set between the respective arrays H1 to Hn to take out the head assemblies. The surfaces of the cut faces of the head assemblies taken out in such a manner are subjected to the hot annealing. The work strains in the surface layers of the cut faces are relieved in this way. While the main purposes of the hot annealing line in the relaxation and uniformization of the work strains. The adjustment of the flatness is effected as well. The thin-film magnetic head which has the flatness of the high accuracy and is free from bending of head patterns, etc., is, therefore, produced. |
