发明名称
摘要 PURPOSE:To improve the dimension accuracy of the electron beam passing hole area of a shadow mask and uniformalize the thickness of a darkened film by executing the heat treatment process, in a prescribed transfer speed, in which annealing and the darkening process are carried-out at a same time in the environment containing steam or CO2 gas. CONSTITUTION:The loading and unloading, electrolytic degreasing, water washing and weak acid treatment, water-washing, drying etc. which were necessary in the conventional, Ni-plating process for a shadow mask material can be avoided perfectly, and further variation of the dimension of an electron beam passing hole area is avoided, and finally the quality of a shadow mask and the yield can be improved, by continuously executing the Ni-plating process and the heating process in succession to the etching process and the resist-film removing process for the shadow mask material. Further, loading and unloading and heaping of flat masks which were required in the conventional darkening and annealing processes can be avoided, and since the flat masks to be put in a furnace are not heaped, the uneveness of thickness of a darkened film can be reduced markedly.
申请公布号 JPH0222974(B2) 申请公布日期 1990.05.22
申请号 JP19810190538 申请日期 1981.11.30
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 KANTO MASAHARU
分类号 C23C2/02;H01J9/14 主分类号 C23C2/02
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