发明名称 |
ROOM TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION |
摘要 |
A curable organopolysiloxane compsn. consists of (a) 100 wt.% of diorganopolysiloxane with hydroxy gp. at both terminal of molecular chain and viscosty of 1,000-1,000,000 cS at 25≦̸C C, (b) 1-20 wt.% of alkoxysilane or organosiloxane with three or more alkoxy gps., (c) 0.05-10 wt.% of organic silicon cpd. with one or more of (I) [R1=methyl or ethyl; Me= methyl; n= 0 or 1 , (d) 0.1-10 wt.% of (II) [Q= di-valent organic silicon gp.; R2=C1-3 alkyl R3=R2 or R2O!. The compsn. has an excellent self-adhesion to plastics.
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申请公布号 |
KR900003534(B1) |
申请公布日期 |
1990.05.21 |
申请号 |
KR19850005298 |
申请日期 |
1985.07.24 |
申请人 |
SHIN-ETSU CHEMICAL CO.,LTD. |
发明人 |
ARAI, MASATOSHI;INOUE, DAKEO;YOKU, KOZI |
分类号 |
C08L83/00;C07F7/18;C08K5/00;C08K5/548;C08L83/04;C08L83/06;(IPC1-7):C08L83/06;C08K5/54 |
主分类号 |
C08L83/00 |
代理机构 |
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代理人 |
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主权项 |
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