HIGH POWER THICK FILM HYBRID IC PACKAGE,申请号JP19880282588-传众专利搜索

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发明名称	HIGH POWER THICK FILM HYBRID IC PACKAGE
摘要
申请公布号	JPH02129946(A)	申请公布日期	1990.05.18
申请号	JP19880282588	申请日期	1988.11.10
申请人	NIPPON AVIONICS CO LTD	发明人	NAKATANI NAOTO
分类号	H01L23/02	主分类号	H01L23/02
代理机构		代理人
主权项
地址

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