| 摘要 |
PURPOSE:To eliminate the warp of an element, and relieve the stress by forming a step-difference part on the side surface of a semiconductor element, and bonding a lead frame thereon by using fixing material composed of insulative organic material. CONSTITUTION:In the case where a semiconductor element 1 manufactured at one time together is divided into individual ones, the element provided with a step-difference side surface 2 and a step-difference part 3 is formed. When the distance from the surface of the element 1 to the step-difference part 3 is made nearly equal to the thickness of a lead frame 4, the connection work of the element 1 and the lead frame 4 is facilitated. After that, the side surface and the lower surface of the frame 4 are fixed by using fixing material 8 composed of insulative organic material. By this set-up, the fixing of a frame is completely finished without increasing the thickness of the element, and the warp of the element can be eliminated.
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