PIN GRID ARRAY SEMICONDUCTOR DEVICE

摘要

PURPOSE:To improve moisture-resistance by a method wherein a tape carrier package type semiconductor device packaged with molding resin is mounted on the surface of a pin grid array(PGA) board. CONSTITUTION:A semiconductor element 3 is locked in a molding die together with a carrier tape 14 and sealed with sealing resin 13. After the sealing resin 13 is cured and a resin package is formed, the resin package is removed from the die together with the carrier tape 14. Then the resin package is separated from the carrier tape 14 to complete a tape carrier package type semiconductor device 11. The tape carrier package type semiconductor device 11 is mounted on the surface of a PGA board 1 by a surface mount technology. With this constitution, moisture-resistance can be improved.