| 摘要 |
PURPOSE:To improve the heat radiation performance of a resin-sealed package by a method wherein a heatsink is buried in the resin-sealed package and a plurality of joint parts which are used for jointing the heatsink with a lead frame at the time of assembly are provided at the corners of the resin-sealed package. CONSTITUTION:A heatsink 11 is buried in a resin-sealed package 24 and a semiconductor pellet 21 is bonded to the heatsink 11. The heatsink 11 has two or more joint parts 13 which are used for jointing the heatsink 11 with a lead frame at the time of assembly and the joint parts 13 are provided at the corners of the resin-sealed package 24. As the pellet 21 is directly brought into contact with the heatsink 11 without using a tab, therefore, the heat from the pellet 21 is radiated outside directly through the heatsink 11. With this constitution, subefficient heat radiation performance can be ensured. |
