| 摘要 |
<p>PURPOSE:To alleviate the stress of thermal expansion and contraction of sealing resin to be applied to a semiconductor chip without increasing its profile size by providing a protective partition wall made of a material having smaller thermal expansion coefficient than that of the resin and surrounding the chip. CONSTITUTION:An insulating plate 2 made of a ceramic plate metallized in a predetermined pattern is brazed to a bottom plate 1 in a vessel composed of the plate 1 made of a copper plate used also as a heat sink plate and sidewalls 6 made of insulating resin adhered to the peripheral edge of the plate 1. A metal board 3 made of a copper plate, a silicon chip 4 and outer lead terminals 5 are sequentially brazed to the metallized parts. A protective partition walls 11 made of resin material are so provided as to surround them and sealed with epoxy resin 7. With such a structure, thermal stress to a silicon chip of sealing resin at the time of use of a semiconductor device can be alleviated without increasing the outer diameter size of the semiconductor device.</p> |
