| 摘要 |
<p>PURPOSE:To minimize the contact area between a wafer and a mounting surface, and reduce the contamination of the rear by constituting a wafer accommodation jig used for semiconductor wafer treatment, by using a plurality of columns having a groove row arranged at specified intervals in the horizontal direction, and inclining the wafer mounting surface of each groove of the groove row at an angle of 3-10 degrees, in the manner in which the inner end becomes the lowest. CONSTITUTION:A boat 7 for heat treatment accommodates a semiconductor wafer 6 of plate type, e.g., circular plate type. Said boat is constituted of four vertical quartz columnar frames 8 and plane type retainers 9 arranged on the upper and lower ends of the frames 8. Inside the columnar frames 8, horizontal grooves 10 are formed at specified intervals. The wafer mounting surface 11 of the lower surface of the groove 10 is not horizontal but inclined downward at an angle of 3-10 degrees. By this set-up, when the wafer 6 is put on the mounting surface 11, the rear of the wafer comes into contact only with an edge line 12 of the mounting surface, so that the contamination of the rear of the wafer 6, and the dust also are reduced, thereby increasing the yield.</p> |
