| 摘要 |
<p>PURPOSE:To realize ultra-miniaturization by forming a light emitting diode array on part of a driving circuit board for driving an optical detection array and bonding the driving circuit board and an optical detection array board. CONSTITUTION:An optical fiber plate 1a having an optical absorber and an optical fiber plate 1b not having an optical absorber are bonded through transparent resin, putting the optical fiber surfaces together. After an optical detection array board 3 is bonded with a circuit board 5 at a predetermined position of the same, a driving LSI 4 is die-bonded with the circuit board 5, and an optical detector 31 and the LSI 4, and the LSI 4 and the circuit board 5 are connected through wire-bonding. Further, a light emitting diode 2 is disposed at a predetermined position and connected with the circuit board 5 through wire-bonding. Successively, the optical detection surface of the optical detector array 31 and the optical fiber surface of the optical fiber plate 1a are bonded and fixed through transparent resin. Hereby, ultra-miniaturization can be realized.</p> |
