发明名称 SEALING METAL MOLD FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable excellent demolding by a method wherein mold resin for sealing is released from a mold by jetting compressed gas. CONSTITUTION:The cavity part 16 of a drag 16 which is mold-registered with a cope 1a by a positioning hole 19 and a positioning pin 17 is filled with resin for sealing from a main runner part 13. When the cope 1a and the drag 1b are separated, an ejector pin 12 ascends. Air-jetting holes 18 are arranged on both sides of the pin 12. Excellent releasing is enabled by the gas pressure of the air jetted from the jetting holes 18. At the same time, the temperature of the resin is reduced, so that the strength and the elasticity of the resin are increased.
申请公布号 JPH02130937(A) 申请公布日期 1990.05.18
申请号 JP19880285163 申请日期 1988.11.11
申请人 NEC CORP 发明人 OIKAWA YOICHI
分类号 H01L21/56;B29C45/43 主分类号 H01L21/56
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