发明名称 SEMICONDUCTOR ASSEMBLY MATERIAL
摘要 PURPOSE:To increase the strength of a die pad itself, to alleviate a deformation due to thermal stress, and to simultaneously reduce an internal crack by dispersing the influence (stress) of outer resin by providing protrusions at the lower part of the pad. CONSTITUTION:Protrusions 2 are provided at the lower part of a die pad 1. Thus, the strength of the pad 1 itself is increased, stress received from sealing resin 6 is dispersed to alleviate the deformation of the pad 1 due to resin stress, and an internal crack is resultantly suppressed. The protrusion may not be square post but be conical or columnar. The protrusions may be regularly disposed or irregularly located.
申请公布号 JPH02130862(A) 申请公布日期 1990.05.18
申请号 JP19880284678 申请日期 1988.11.10
申请人 SEIKO EPSON CORP 发明人 SHINDO AKINORI
分类号 H01L23/50 主分类号 H01L23/50
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