发明名称 MANUFACTURE OF IC CARD MODULE
摘要 <p>PURPOSE:To avoid the leakage of resin by a method wherein a shielding plate having an aperture corresponding to the resin-sealing part molding cavity of molding dies is tightly fitted to a board and locked in the dies and then molding resin is cast into the cavity along the upper surface of the shielding plate. CONSTITUTION:A shielding plate 11 having an aperture 11a corresponding to the resin-sealing part molding cavity of molding dies 6 and 7 and, further, having a surface facing the runner 7c and gate 7b is tightly fitted to a board 1 and locked in the dies 6 and 7. Then molding resin 4 is cast into the cavity 7a along the upper surface of the shielding plate 11. The resin 4, therefore, is cast into the cavity 7a of the dies 6 and 7 without touching the board 1. After the molded resin is removed from the dies, the resin 4 cured in the gate 7b can be removed easily from the upper surface of the board 1 by removing the shielding plate 11 from the board 1. With this constitution, the penetration of the resin into the electrode terminal side of the board 1 caused by the leakage of the resin 4 through the boundary between the board 1 and the lower die 6 can be avoided.</p>
申请公布号 JPH02129933(A) 申请公布日期 1990.05.18
申请号 JP19880284439 申请日期 1988.11.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 KOTAI SHOJIRO;OCHI KATSUNORI;IKEDA YASUKI
分类号 B42D15/10;B29C45/14;H01L21/56 主分类号 B42D15/10
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