| 摘要 |
PURPOSE:To obtain a wiring board excellent in wiring density by a method wherein an adhesive resin layer is formed on a board of high releasability, an insulating wire is provided at a specified position on the board to serve as a wiring pattern, and the wiring pattern is transferred onto an insulating board. CONSTITUTION:An inner circuit 6 is formed on an insulating board 5, an insulating resin layer 7 is formed thereon and made to set, an adhesive resin layer 2 is formed on the surface of the layer 7, and a crossed wiring wire is provided onto the surface of the adhesive resin layer 2 through an NC wiring machine. And, the adhesive resin layer 2 is formed on the surface of a releasable board 8 of high releasability, and a tilted wiring wire 4 is provided onto the surface of the resin layer 2. Then, the crossed wiring wire 3 and the tilted wiring wire 4 are overlapped with each other and bonded in lamination as being positionally aligned, and then the releasable board 8 is separated off. By this setup, a tilted wiring pattern is transferred onto a crossed wiring face. |
