发明名称 |
SEMI-CONDUCTOR POWER MODULE |
摘要 |
If such modules have a plastic housing and a ceramic substrate used as housing base, there is the danger that as a result of the transmission of mechanical forces from the region of a heat sink screw fixing to the ceramic substrate, cracks are formed in said ceramic substrate which reduce the insulation strength. To improve the protection of the ceramic substrate (1) against mechanical loads, it is proposed that reinforcing rings (4, 6) made of copper foil are provided on top of the ceramic substrate (1) in the region of the contact surfaces (18, 18.1) of the housing (12) at least in the region of the contact surface (18) of a central fixing part (13). In addition it is proposed that the bottom of the ceramic substrate (1) is provided with a copper layer (5). <IMAGE> |
申请公布号 |
EP0243637(A3) |
申请公布日期 |
1990.05.16 |
申请号 |
EP19870103618 |
申请日期 |
1987.03.12 |
申请人 |
ASEA BROWN BOVERI AKTIENGESELLSCHAFT |
发明人 |
NEIDIG, ARNO, DR. DIPL.-PHYS.;BOBINGER, DIETRICH, DIPL.-PHYS. |
分类号 |
H01L23/049;H01L25/07;(IPC1-7):H01L21/58;H01L23/34 |
主分类号 |
H01L23/049 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|