| 摘要 |
<p>PURPOSE:To contrive the simplification of the structure of a module, the improvement of the bondability of the module and the improvement of the mechanical strength of the module by a method wherein an IC chip is directly connected to terminal members and a molding resin is filled between terminal parts. CONSTITUTION:In an IC module 1, an IC chip 2 is connected to a member 3 formed with terminals to come into electrical contact with the exterior through connecting members 4 and is fixed and sealed with a resin 5. Moreover, the member 3 is performed a surface treatment using a plating for external terminal use, such as an Ni plating, an Au plating and the like, on the side of the faces of the external terminals or a plating for IC chip bonding use, such as a Cu plating, an Au plating and the like, on the side of an IC chip bonding surface. At the time of manufacture of a module, a lead frame 20 with terminal patterns formed thereon is formed and an IC chip 19 is connected to the frame 20 through bumps 21 and is fixed on the frame 20. Then, the rectangular frame 20 is arranged in a molding metal mold 23 and a molding resin 24 which is a thermosetting resin is filled between terminal parts in such a way as to cover the terminal parts and is hardened.</p> |
