| 摘要 |
<p>PURPOSE:To remove automatically a film from a ring frame and to separate a defective chip from the film by a method wherein the film is pulled by a clamping means and is bent at an acute angle by a knife edge. CONSTITUTION:When a work 70 having a defective chip 75 left on the upper face of a film adhered on the lower face of a ring frame 71 is inserted between a substrate 2 and a carrying-out roll 28, the work 70 is moved forward of the substrate 2 and the roll 28 is stopped at a position where the front part of the film comes out some forward of a knife edge 35 of the substrate 2. Then, the front part of the film is peeled from the frame 71 by a pusher 16 and is drooped. Moreover, a clamping means 42 is shut to clamp the lower end of the film and begins to move in the lower direction of the substrate 1. Thereby, the work 70 is pulled by the film to move and the film is bent at an acute angle at the part of the edge 35 and is peeled from the frame 71. Moreover, a guide plate 54 gets up and guides the chip 75 separated from the film bent at the acute angle along the edge 35 to extrude the chip 75.</p> |
