发明名称 MEANS AND METHOD FOR MEASURING THROUGH HOLE PART RESISTANCE FOR SEMICONDUCTOR DEVICE MULTILAYER INTERCONNECTION
摘要 PURPOSE:To lessen the main causes of the generation of an error and to make it possible to measure the resistances of through hole parts with good accuracy and easily by a method wherein two multilayer interconnections are formed, the resistance of each multilayer interconnection is measured and a resistance per one piece of the through holes is found. CONSTITUTION:A measuring instrument is provided with a multilayer interconnection 20 obtainable by connecting layer wirings 3 and 6, whose integrated lengths are respectively L1 and L2, to one another through (n) pieces of through holes 5 and a multilayer interconnection 30 obtainable by connecting layer wirings 8 and 9, whose materiels, sectional areas and integrated lengths are identical with those of the wirings 3 and 6, to one another through (m) pieces of through holes 5. Moreover, the wirings 3 and 8 are equal in integration resistance and the wirings 6 and 9 are equal in integration resistance. A difference between the resistances of the interconnections 20 and 30 is equal to a difference between the integration resistances of the holes 5 being included in the multilayer interconnections. Accordingly, the resistances of the hole parts 5 in each multilayer interconnection can be found on the basis of a resistance per one piece of the hole parts 5 in each multilayer interconnection.
申请公布号 JPH02128441(A) 申请公布日期 1990.05.16
申请号 JP19880280337 申请日期 1988.11.08
申请人 FUJITSU LTD 发明人 YADA HIROTAKA
分类号 G01R31/26;H01L21/66;H05K3/46 主分类号 G01R31/26
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