发明名称 MICROELECTRONIC DEVICE AND THICK FILM HYBRID CIRCUIT
摘要 <p>In microelectronic components and thick-film hybrid circuits, the multilayer substrates of the said components and the substrates of the said circuits are produced using liquid crystalline polymers which can be processed by a thermoplastic method.</p>
申请公布号 EP0254948(A3) 申请公布日期 1990.05.16
申请号 EP19870110106 申请日期 1987.07.14
申请人 BASF AKTIENGESELLSCHAFT 发明人 PORTUGALL, MICHAEL, DR.;STERZEL, HANS-JOSEF, DR.;BLINNE, GERD, DR.;VONDENHAGEN, HEINZ-DIETER;SEILER, ERHARD, DR.;SCHMIDT, HANS-FRIEDRICH, DR.;VON TOMKEWITSCH,SYBILLE
分类号 H01L23/14;H05K1/03;H05K3/46;(IPC1-7):H01L23/14;H01L21/84 主分类号 H01L23/14
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