Process of producing copper plated resin article.

摘要

A process of producing a copper-plated resin article by forming a copper layer strongly adhered to the resin article by a dry process, which comprises heating a resin article having a heat deformation temperature higher than 165 DEG C and copper formate under a reduced pressure or in a non-oxidative atmosphere in such a manner that the resin article is heated to a predetermined temperature in the range of at least 165 DEG and lower than the heat deformation temperature of the resin article and the copper formate is temperature-raised at a rate of at least 1 DEG C/min in the temperature range of at least from 130 DEG C to 165 DEG C and kept at a temperature of at least 165 DEG C.