| 摘要 |
PURPOSE:To prevent an electrode pad from being corroded due to the moisture absorption of water content by a method wherein the Al electrode pad, which is not connected by a bonding wire, is covered with a bonding ball. CONSTITUTION:A bonding ball 3 is applied on an Al electrode pad 4' and is not connected to an external terminal 7. This ball 3 is formed by a method wherein a gold wire is bonded and thereafter, the wire is cut by a hydrogen torch immediately after the formation of the ball 3. The pad 4', which is connected by a gold wire 1, is connected to the terminal 7. This gold ball 3 is applied on the surface of the pad 4' and is bonded to this pad, and even if it is operated with a resin mold in a moisture-containing atmosphere, the surface of the pad 4' is never corroded. |
