| 摘要 |
<p>PURPOSE:To provide a free selection between single-sided and double-sided packages and miniaturize the device by forming a substrate guide groove inside a reversing guide member and additionally providing a stop and control pin in a portion of the groove to be freely moved in and out of the guide groove by compressed air. CONSTITUTION:Adjusting movable plates 7a, 7b are moved by a handle 5a to be adapted to the lateral width of a substrate. Next, the substrate having electronic parts packaged is inserted in guides 31a, 32a of both reversing guide parts 31, 32 by an inserting conveyer 20. Then, in no reversal, a control pin 33 is plunged in the substrate to be sent to a delivery conveyer 21 by a rodless cylinder device 25. In the reversal, the control pin 33 is protruded into guide grooves 31a, 32a by compressed air to stop and hold the substrate in the guide groove. Next, the cylinder 22 is driven to reverse reversing guide members 31, 32 so that this device can be applied to the packaging of one surface and both surfaces with a compact device.</p> |
