| 摘要 |
PURPOSE: To antistatically treat an adjacent periphery of a microcircuit by incorporating several wt.% of a conductive adhesive, resin and protective varnish or several vol.% of an antistatic agent. CONSTITUTION: A conductive layer (copper thin plate) 2 is covered at a side opposed to an insulating layer 3 with an Ni layer, and then covered with an Au layer. The layers 3 and 2 form a soft support. A conductive adhesive layer 4 is made of an epoxy resin containing Ag, and adhered to a lower side surface of a board of a pellet 1. Polymerizable resins 6 are arranged at positions along two opposite edges of the pellet 1. The resin 6 flows to an overall length of a channel 11 between the other opposed side of the pellet 1 and an adjacent edge of the layer 3, and is blended to form two resin regions 62 integrated with an edge region 41 of a conductive adhesive. Eventually, an upper side surface and an entirety including a conductive wire 5 are covered with a protective varnish layer 7. Several vol.% of antistatic agents adapted to the resin 6 and the varnish 7 are respectively contained in the resin 6 and the varnish 7. |
