| 摘要 |
<p>PURPOSE:To obtain a semiconductor package where a detect of a void is not caused even in the semiconductor package having highdensity leads by a method wherein an interval between the leads at the inside near a resin injection port is made equal to or wider than a width of the injection port. CONSTITUTION:An interval W2 of leads 4 at the inside near a resin injection port 7 is made partially wider than a width W1 of the injection port 7. In such an assembly, a resin 9 injected in a part where the interval of the leads 4 is wide is separated to the surface and the rear surface of the leads 4; accordingly, the resin 9 is filled equally to the surface and the rear surface of the leads 4; a defect of a void is not caused. Wires 5 are used to connect electrodes 3 at the inside of a semiconductor element 1 to the leads 4; however, even when tabs 2 are used instead of the wires 5, the same effect can be obtained.</p> |
