| 摘要 |
For the purpose of direct evaporative cooling, power semiconductors (1) are pushed into a container which is designed as a cylindrical single-layer metal bellows (18) and contains the evaporative cooling liquid and in which one of the end-face closure lids (8, 9) providing a vacuumtight seal has bushings (5) for electrically connecting the power semiconductor (1). Such a system should be designed so as to be readily assembled and it should meet high dynamic loads such as those which occur in a vehicle. For this purpose, the power semiconductors (1), along with the associated wiring components (12, 13, 14), are clamped by means of tie bolts (11) as an electrically completely interconnected unit between one closure lid (8) which incorporates the electrical bushings (5) and is composed of metal, and a centring plate (3) resting on the inside wall of the metal bellows (18). <IMAGE> |
