| 摘要 |
PURPOSE:To enhance the mounting rate, and moreover to enable to decide quality of the semiconductor device without removing the semiconductor device thereof when a test is to be performed by a method wherein a part of a connecting pattern to connect between terminal leads and a semiconductor element is made as to be cut off easily from the outside. CONSTITUTION:The separating parts 3 to be cut off independently respectively are provided to the connecting part P to connect between the terminal leads 2 and the semiconductor element of the semiconductor device 1. When the semiconductor device 1 is mounted directly to a printed plate 5, height of the parts becomes to height of the semiconductor device 1 itself, and moreover because no socket is used, the occupying area becomes also to the area of the semiconductor 1 itself, and to narrow the interval between electronic circuit packages can be attained. Moreover mounting plane density can be also enhanced, and mounting density can be enhanced synthetically. |
