| 摘要 |
PURPOSE:To reduce the influence of electromagnetic wave disturbance by applying electromagnetic wave shielding material or sticking a metal net on the surface of sealing resin material. CONSTITUTION:After a lead frame 5 is sealed by using resin 2, lead 3 and a frame 5 are covered with a mask 6 made of resin or the like; electromagnetic shielding material liquid 11 is sprayed from a nozzle 10; the electromagnetic wave shielding material 1, 4 is applied on the external surface of the resin material 2, without coming into contact with the leads 3. A metal net 18 is stuck so as to cover almost all region of the resin material 2 of a resin seal type semiconductor device. The metal net 13 is arranged so as not to come into contact with the leads 3. Thereby, electromagnetic wave disturbance can be reduced. |
