| 摘要 |
<p>PURPOSE:To provide a surface with no projection on a cut surface of a semiconductor element chip to be divided by sticking an adhesive sheet to the rear surface of a semiconductor base in a manner that a groove is mated with a boundary dividing semiconductor forming area of the semiconductor base and dividing into semiconductor element chips by means of a dicing blade. CONSTITUTION:A semiconductor base 10 connected on an adhesive sheet 1a for dicing is divided into light emitting diode array elementchips by the dicing method. For dividing, first a dicing blade 12 is positioned in the center of a groove 9 and dicing is carried out by setting cutting depth, for example, 30mum from the surface of a first adhesive sheet 2. The dicing blade 12 cuts all the time beyond the rear surface of the semiconductor base 10, and as a blade edge positioned right under the dicing blade in the process of cutting is in a space of a groove 14, and the blade edge is not brought into contact with an adhesive sheet 1b unnecessarily to keep the blade edge washed with cutting liquid all the time, and good cutting quality is kept without clogging. As a result, a cut surface without projection is provided as a cut surface the element chip.</p> |
