| 摘要 |
<p>PURPOSE:To alleviate the temperature rise of a resin-sealed semiconductor device due to the radiation heat of an infrared ray at the time of mounting by providing a heat shielding roof at the top of the sealing resin of the device. CONSTITUTION:A semiconductor element secured to an island and metal fine wirings are sealed with rectangular sealing resin 3, and external leads 4 connected at the ends to the wirings are disposed in four directions outside the resin 3. A roof 1 supported by four supporting rods 2 connected to the resin 3 is so disposed as to cover the upper face of the resin 3. When the roof 1 and the rods 2 are formed of resin, they are manufactured by an integral die, the rods are inserted into the recesses of the resin 3 and secured with adhesive.</p> |
