| 摘要 |
PURPOSE:To evade the damage on a bonding pad by forming an inside inclination surface part in which inclination is at least doubly changed, inside the flat surface part of a capillary tip. CONSTITUTION:A capillary 26 is formed in the following manner. A flat surface part 26b is arranged so as to be concentric to a wire insertion hole 26a and constitutes a circular ring shape; inside the flat surface part 26b, an inside inclination surface part 26c is so formed that the inclination is at least doubly changed with respect to the wire insertion hole 26a; outside the flat surface part 26b, while an outside inclination surface part is formed so as to gently incline. One end-portion of wire material 36 composed of copper system material is bonded to a bonding pad of a semiconductor pellet 12 by using a ball bonding 13a. The other end-portion is bonded to a base material surface composed of copper system material at an inner part 9a of each lead 9. Thereby, the excessive press-crash and the damage on the bonding pad can be prevented, while the bonding strength of wire is sufficiently secured. |
