| 摘要 |
PURPOSE:To eliminate the flowout of insulating adhesive to a bonding pad, and improper connection due to void, gap by forming the bonding part of a semiconductor device in two stages, employing insulating frames provided with leads on upper and lower faces as the second stage bonding part, connecting the first to second stages with corresponding leads with conductive adhesive, and sucking them to a through hole formed at an insulator. CONSTITUTION:A recess for placing an element is formed at the center of an insulating board 1, each lead 2 is arranged at one end near the upper end of the recess on the horizontal face of the upper stage of the recess and at the other end toward the outer periphery of the board 1. Then, leads 3 disposed between the adjacent leads 2 and provided at one end each from the upper end of the recess are provided. Subsequently, an insulating frame 4 having an opening larger than the recess is provided, and lead 5, 6 are connected via a through hole 7. Then, the frame 4 is placed on the periphery of the recess, the leads 6 and a solder film formed on the surface of the leads 3 are abutted to be connected by a reflowing method. |
