发明名称 COMPOUND SEMICONDUCTOR SUBSTRATE
摘要 PURPOSE:To obtain a III-IV compound semiconductor layer of high quality wherein residual stress and crystal defects are little by laminating at least three layers of respectively specified semiconductors. CONSTITUTION:At least three layers of a first semiconductor layer 2 composed of III-IV compound, a second semiconductor layer 3 and a third semiconductor layer 4 are laminated on a group IV substrate 1. The second semiconductor layer 3 is composed of compound having lattice constants capable of generating stress in the direction opposite to the stress generating at the time of laminating the first semiconductor layer 2 which is caused by the difference of thermal expansion coefficients between the group IV substrate 1 and the first semiconductor layer 2. The third semiconductor layer 4 is composed of the same III-IV compound as the first semiconductor layer 2. Thereby, residual stress and crystal defects can be reduced, and a III-IV compound semiconductor base layer of high quality is obtained.
申请公布号 JPH02125612(A) 申请公布日期 1990.05.14
申请号 JP19880280041 申请日期 1988.11.04
申请人 SHARP CORP 发明人 SEKI AKINORI;ATSUNUSHI FUMIHIRO;KUDO ATSUSHI;KOBA MASAYOSHI
分类号 H01L21/20;H01L21/205;H01L21/338;H01L29/812;H01L31/04;H01L31/10;H01L33/30;H01L33/34;H01S5/00 主分类号 H01L21/20
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