| 摘要 |
PURPOSE:To easily discriminate whether or not used inside-layer substrates are proper by observing the cross section of a multilayer printed wiring board after the board is formed by providing patterns corresponding to management numbers on an outside shape working line after lamination. CONSTITUTION:At the time of forming a circuit pattern 3, patterns 4 corresponding to management numbers are simultaneously formed on an outside shape working line after lamination and used as inside-layer substrates 5. A plate 6 plated with copper on one surface, bonding agent sheet 7, inside-layer substrate 5, bonding agent sheet 7, inside-layer substrate 5, bonding agent sheet 7, plate 6 plated with copper on one surface, and holding jig 8 are successively placed on a holding jig 8. Then a multilayered printed wiring board is obtained by thermally hardening the body thus constituted in a hot press and shaping the outside of the plate 9. Therefore, the management numbers 4 of the inside-layer substrates 5 can be confirmed visually and any improper inside-layer substrates can be found before a wiring inspection process. |
