| 摘要 |
<p>PURPOSE:To realize reliability of the level equal to a usual package while the integration density approximate to a flip chip is secured by sticking a surface protecting plate provided with surface electrodes, on a semiconductor chip surface; and covering the side surface with resin. CONSTITUTION:The following are provided; a semiconductor chip 1a having a plurality of electrode pads 2 on the surface; a surface protecting plate 5a provided with rear electrodes 7b composed of bumps corresponding with each of the electrode pads 2, and surface electrodes 7a composed of solder bumps electrically connected by using solder filling the rear electrodes 7b, through hole electrodes 6 and holes; binder 8 which connects respectively the electrode pads 2 and the rear electrodes 7b and sticks the surface protecting plate 5a on the semiconductor chip 1a; a vessel containing resin 12' covering the semiconductor chip 1a and the side surface of the surface protecting plate 5a. A rear protecting plate 3a is connected to the rear of the semiconductor chip 1a via a connection layer 4, and constitutes the vessel together with the resin 12'. Thereby, an integrated circuit having high reliability and high mounting density can be obtained.</p> |
