| 摘要 |
PURPOSE:To make it not always necessary that, in the case of developing a new kind of item, layout is changed by-designing, and a case is anew designed, by providing a semiconductor chip with interconnection pads. CONSTITUTION:On a semiconductor chip 2, metal pad 4-1-4-4 are arranged, and a lead P2 and a bonding pad B2, and a lead P14 and a bonding pad B7 can be respectively wire-bonded by using a bonding wire 5. Since repeating pads are arranged on a semiconductor chip, restrictions of relative position relations between the leads P1-P24 of a case 1 and the bonding pads B1-B10 of the semiconductor chip 2 are relieved. Thereby, the process preparation term for design change can be saved. Even in the case where a standard case can not be used in a conventional art, and a new case is designed compulsively, the standard case may be applicable and can facilitate the process. |
