| 摘要 |
PURPOSE: To improve the adhesion between a gold wire and the lead-tin solder by inserting a pole of a terminal of a wire, which includes gold, into a solder layer in the condition that it dose not reach a board. CONSTITUTION: A terminal of a wire 12 is formed into a gold or gold alloy pole 14, and it includes gold at least at 50%, and it is inserted into a solder pad 16 by crimping such as thermal sound wave, ultrasonic wave, thermal crimp. This pad 16 receives a terminal of the wire, and at this stage, the wire does not pass through the pad so that it does not contact with the board, and the wire is separated from the board 20, and pushed at a distance in the condition that it is surrounded by the tin solder. A remarkably thin metal-to-metal compound 30 is obtained by the crimping, and this metal-to-metal compound 30 supports the adhesion of the wire and the solder. At this stage, solder is maintained at a temperature lower than the lowest eutectic point of the solder. |
