| 摘要 |
PURPOSE:To remove resin burr which is attached to a lead part at the time of resin molding by cutting the inner surface of the lead part at the same time when a lead frame is cut. CONSTITUTION:A semiconductor substrate is assembled into a lead frame 2. Thereafter, sealing resin is injected in the sequence from a runner 3 to a gate 4 by using an exclusive metal mold. The resin is molded into a specified package 1. Unnecessary resin burr 5 is firmed along a lead part. A step part 2b is provided at the lead part of the lead frame 2 beforehand. Said part is exposed to the outside of the package 1. The lead frame and the inner surface C of the lead part are cut along the step part. Cutting is performed along dotted lines B and B', and a completed product is obtained. In this method, the burr can be removed readily when the lead frame is cut without providing a deburring step. |
