发明名称 SOLDER CREAM PRINTING METHOD
摘要 PURPOSE:To eliminate defective adhesion of solder cream by operating a squeegee alternately in two directions crossing each other thereby bonding the squeegee firmly to a solder mask board. CONSTITUTION:When solder cream 9 printing is carried out after part 6 is mounted on a printed circuit board 8 in preceeding process, a squeegee 1a is moved in X-direction 2a then a squeegee 1b is moved in Y-direction 2b. Since the solder cream 9 is fed sufficiently to solder printing points around the part 6 mounted in preceeding process, the solder cream 9 can be printed correctly at all printing positions. Even when there is a protrusion on a mask board, the solder cream 9 can be fed closely to the protrusion 5 and thereby defective adhesion of the solder cream 9 to a conductor patter 4 due to insufficient contact of the squeegee can be eliminated.
申请公布号 JPH02122695(A) 申请公布日期 1990.05.10
申请号 JP19880276699 申请日期 1988.11.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMADA MUNEHISA
分类号 B23K3/06;H05K3/12;H05K3/34 主分类号 B23K3/06
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