| 摘要 |
<p>PURPOSE:To shorten processing time by applying groove processing to a substrate along the membrane pattern thereof before polishing the rear of the substrate. CONSTITUTION:Grooves 13 are formed to a substrate wafer 12 composed of a magnetic body having a large number of membrane patterns 11 formed thereto along the membrane patterns 11, for example, by grindstone processing or laser processing so as to leave a definite thickness (t) in the substrate wafer 12. The substrate wafer 12 is bonded to a flat plate 14 by wax on the side of the patterns 11 and the rear of the substrate wafer 12 is subjected to plane polishing or lapping to remove the wafer 12 up to the thickness (t) or more and the substrate wafer 12 is divided at every thinned membrane patterns 11. Thereafter, the substrate wafers 12 are detached and washed to obtain the chips 15 of thinned membrane magnetic transducers. By this method, since the cut depth of cutting processing becomes shallow, processing time can be shortened.</p> |
