| 摘要 |
PURPOSE:To make it possible to realize the burn-in of semiconductor integrated circuits with the same form and different functions by inserting pins in the through-holes of a printed substrate, and linking to the sockets or to the terminals of connectors. CONSTITUTION:On the printed substrate of the first layer of this burn-in board, the wiring from through-holes 11 to 18 for leads of IC sockets to through-holes 21 to 28 for the pin insertion, and the wiring from substrate terminals 31 to 34 to through-holes 41 to 44 for the pin insertion are patterned. On the printed substrates from the second layer to the fourth layer, the wiring from through- holes 51 to 58 for the pin insertion to through-holes 51 to 58 for the pin insertion is patterned. As a result, by a simple work to insert the pins in the through- holes 21 to 28, and 51 to 58, a desired voltage can be applied to a necessary terminal. Consequently, the burn-in of semiconductor integrated circuits of the same form and various sorts can be realized. |
