| 摘要 |
The EEPROM IC chip (24) is pasted on an insulation substrate (21) made of the glass epoxy resin by the conductive adhesive. The circuit patterns (23) are printed on the substrate and connected to the chip taps by the fine wires (25). The chip and the wires are covered by a transparent cap (26) made of the ultraviolet transparent glass, crystal, or alumina to erase the memorised data with the ultraviolet ray. Then the area occupied by the EEPROM on the substrate can be reduced. |
