发明名称 MULTILAYER PRINTED BOARD DEVICE
摘要 <p>PURPOSE:Not only to eliminate noises effectively but also to increase a region where a wiring can be provided by a method wherein two or more laminated ceramic capacitor chips are provided between a ground layer and a power source layer. CONSTITUTION:Signal layer conductors 5 and 6 are provided on the outer side of a ground layer conductor 1 and a power source layer conductor 2 respectively through the intermediary of insulating layer 3 and 4. An insulating layer 7, in which two or more laminated ceramic capacitor chips 10, 101... are buried at a specified interval, is provided between the ground layer conductor 1 and the power source layer conductor 2. These laminated ceramic capacitor chips 10, 101... are connected between signal layer conductors 4 and 5, the power source layer conductor 2 and the ground layer conductor 1 and serve to absorb signal noises and power noises. And, as capacitors are buried, a signal layer conductor can be increased in effectively usable area, so that workability can be remarkably improved.</p>
申请公布号 JPH02121393(A) 申请公布日期 1990.05.09
申请号 JP19880274959 申请日期 1988.10.31
申请人 NEC CORP 发明人 SHINTANI KAZUO
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址